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TSOP572.., TSOP574..
www.vishay.com
ASSEMBLY INSTRUCTIONS
Reflow Soldering
? Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
? Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
Vishay Semiconductors
Manual Soldering
? Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
? Finish soldering within 3 s
? Handle products only after the temperature has cooled off
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
? Handling after reflow should be done only after the work
surface has been cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
250
255 °C
240 °C
max. 260 °C
245 °C
217 °C
200
max. 20 s
150
100
max. 120 s
max. 100 s
50
0
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
0
50
100
150
200
250
300
ORDERING INFORMATION
19800
t (s)
max. 2 cycles allowed
ORDERING CODE
TSOP57..TT1
TSOP57..TT2
PACKAGING
Tape and reel
VOLUME (1)
MOQ: 1800 pcs
MOQ: 7000 pcs
REMARKS
3.95 mm x 3.95 mm x 0.75 mm
Note
(1) MOQ: minimum order quantity
Rev. 1.7, 25-Feb-14
7
Document Number: 82434
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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